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BOS Semiconductors to Showcase AI Innovations at Auto China 2026
BOS Semiconductors will participate in Auto China 2026 (2026 Beijing International Automotive Exhibition), presenting the latest advancements in AI semiconductor technology for the physical & automotive industry. Visitors to our booth will have the opportunity to experience the Eagle-N AI Accelerator and AI Box in action. Through this showcase, BOS Semiconductors demonstrates its commitment to advancing Physical AI and Automotive AI, enabling smarter, more efficient, and in
Apr 6


BOS Semiconductors’ AI Semiconductor Design Technology for Future Mobility Recognized as National Strategic Technology
BOS Semiconductors’ AI semiconductor design technology for future mobility has been officially recognized as a National Strategic Technology by Korea’s Ministry of Science and ICT. This designation highlights the importance of BOS Semiconductors’ high-performance, low-power AI semiconductor technology , which plays a key role in advancing the future of mobility and the emerging Physical AI ecosystem. BOS Semiconductors is developing next-generation AI chips including Eagle-
Mar 11


BOS Secures Approximately $67 Million in Series A Funding to Accelerate Automotive AI Innovation
BOS Semiconductors has successfully raised approximately $67 million in its Series A funding round. The company, a fabless semiconductor startup specializing in automotive AI chips, is accelerating the development of its high-performance AI solutions for autonomous driving and in-vehicle infotainment (IVI). With strong backing from both existing and new investors, BOS Semiconductors is preparing for the mass production of its flagship AI accelerator, Eagle-N, while expanding
Feb 23


Showcasing Flexible Automotive AI with Eagle-N at CES 2026
BOS Semiconductors participated in CES 2026 in Las Vegas , where we engaged with global automotive OEMs, Tier-1 suppliers, and AI ecosystem partners to discuss next-generation automotive solutions. During the event, we showcased our Eagle-N–based AI Box , demonstrating how AI capabilities can be flexibly expanded in vehicles without replacing existing in-vehicle infotainment (IVI) systems. The demonstrations attracted strong interest from potential customers and partners, und
Jan 28


BOS at CES 2026: Spotlight on Automotive AI
At CES 2026 , BOS Semiconductors captured strong interest from industry leaders across the global technology ecosystem. Beyond engaging discussions with our valued business partners, we were also honored to receive attention from leading international media outlets. As part of this momentum, we are pleased to share an exclusive interview with DIGITIMES Asia , featuring our CEO, Dr. Jaehong Park . In the interview, Dr. Park shares his insights on the future of the Automotive A
Jan 27


BOS Semiconductors selects Ceva’s AI DSP for next-gen ADAS platforms
BOS' chiplet startegy enhances scalability, with Eagle-A designed to work alongside Eagle-N AI acclerator in multi-die configurations connected via UCIe and PCIe As vehicles evolve toward software-defined architectures and complex ADAS, the industry is turning to real-time sensor processing, safety-critical intelligence, and physical AI to bridge perception and actuation. In line with this trend, Ceva Inc. announced that BOS Semiconductors has licensed its SensPro AI DSP arch
Jan 16


BOS to Exhibit at CES 2026, Showcasing AI Box Demo for Next-Generation Mobility
We’re excited to announce that BOS Semiconductors will be exhibiting at CES 2026 in Las Vegas (Jan 6–9)! At CES 2026, we’ll be showcasing our AI Box demo for next-generation mobility , powered by Eagle-N , our high-performance AI accelerator. The AI Box is designed to help automotive OEMs add an “AI brain” to vehicles with minimal changes to existing IVI systems , enabling flexible and scalable on-device AI capabilities. 📍 Visit us at:Venetian Expo, Hall A — Booth # 50017
Dec 24, 2025


BOS Semiconductors and LIG Nex1 Sign Strategic MOU on Physical AI for Robotics & Drones
BOS Semiconductors has entered into a strategic memorandum of understanding (MOU) with LIG Nex1 , a leader in advanced defense and robotics technologies, to collaborate on the development of Physical AI solutions for robotics and drone applications . Signed on November 28 , the agreement reflects a shared vision between the two companies to advance next-generation Physical AI and On-Device AI technologies , accelerating their path toward real-world deployment and commercializ
Dec 17, 2025


BOS Semiconductors ESG in Action
As the year comes to a close, BOS Semiconductors is grateful to share a meaningful story from our ESG journey. We are proud to support para-swimming athlete Ms. Yeo, and we are delighted to celebrate her 🏅 gold medal at the 2nd Cheonan Mayor’s National Para Swimming Championship. 🏊 Her achievement reminds us that encouragement and care can open doors to opportunity—and that small acts of support can make a real difference. This year-end, we reaffirm our commitment to giving
Dec 16, 2025
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